A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are suggested. Refer to the Philips Semiconductors application note AN10264 for more details.
Ensure that the device is operated within the recommended voltage and current limits. Use a suitable heat sink and thermal interface material to maintain a junction temperature below 150°C. Also, follow proper PCB design and layout guidelines to minimize thermal resistance.
Critical timing parameters include input rise and fall times, output delay, and clock frequency. Ensure signal integrity by using controlled impedance traces, minimizing trace lengths, and using signal termination resistors as needed. Refer to the Philips Semiconductors application note AN10265 for more information.
Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Ensure that the ESD protection devices are rated for the maximum voltage and current of the SCN2681AC1A44. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Handle the devices by the body or leads, avoiding touching the pins or die. Follow the ESD Association's guidelines for handling ESD-sensitive devices.
