A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
Implement a robust power-on reset circuit, ensure a stable clock signal, and consider using a temperature sensor to monitor and adjust system performance accordingly.
Use a shielded enclosure, ensure proper grounding and decoupling, and implement EMI filters on I/O lines. Follow NXP's application notes and guidelines for EMI and EMC compliance.
Use the device's power-down modes, optimize clock frequencies, and minimize I/O activity. Consider using a power management IC to regulate voltage and current.
Perform functional testing, boundary scan testing, and environmental testing (temperature, humidity, vibration). Validate the device's performance using NXP's recommended test vectors and procedures.
SCC2691AC1A28 datasheet
by NXP Semiconductors
