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    SBT-BGA-7000 datasheet by Ironwood Electronics

    • Socket For Burn-In and Test Applications; Max Pincount: 484; Top Pitch (mm): 0.5; IC Array X: 22; IC Array Y: 22; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.5; IC Size X (mm): 12; IC Size Y (mm): 12; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.2; IC Ball Height Max (mm): 0.3; IC Ball Diameter Max (mm): 0.35; Max Package Code: Part Description: Stamped pin Burn-in socket
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    SBT-BGA-7000 datasheet preview

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