The recommended PCB footprint for SBR30A60CTBQ-13 is a standard SOD-123 package footprint with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm.
While SBR30A60CTBQ-13 has a maximum operating junction temperature of 150°C, it's recommended to derate the device's current handling capability at high temperatures. Consult the datasheet for thermal derating information.
To ensure reliability, follow proper PCB design and assembly guidelines, use a robust soldering process, and consider implementing additional protection circuits (e.g., overvoltage protection, ESD protection) as needed.
Yes, SBR30A60CTBQ-13 is suitable for switching power supply applications due to its fast switching speed and low voltage drop. However, ensure that the device is properly sized for the application's current and voltage requirements.
Store SBR30A60CTBQ-13 in a dry, cool place with a temperature range of -40°C to 30°C and relative humidity below 60%. Avoid exposing the devices to direct sunlight, moisture, or extreme temperatures.
