SBR30A100CTB-13 datasheet by Diodes Incorporated

SBR30A100CTB-13 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR30A100CTB-13?
  The recommended PCB footprint for the SBR30A100CTB-13 is a standard SOD-123 package footprint with a pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
• How do I ensure the reliability of the SBR30A100CTB-13 in high-temperature applications?
  To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal management system, and ensure that the device is properly soldered to the PCB.
• Can I use the SBR30A100CTB-13 in a high-frequency switching application?
  Yes, the SBR30A100CTB-13 is suitable for high-frequency switching applications up to 100 kHz. However, it is recommended to consult the datasheet and application notes for specific guidance on high-frequency operation.
• What is the maximum allowable voltage stress on the SBR30A100CTB-13?
  The maximum allowable voltage stress on the SBR30A100CTB-13 is 100V, as specified in the datasheet. Exceeding this voltage may damage the device.
• How do I handle ESD protection when handling the SBR30A100CTB-13?
  It is recommended to follow standard ESD handling procedures when handling the SBR30A100CTB-13, including using an ESD wrist strap, ESD mat, and ESD-safe packaging.