SBR30A100CT datasheet by Diodes Incorporated

SBR30A100CT Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR30A100CT?
  The recommended PCB footprint for the SBR30A100CT is a standard SOD-123 package footprint with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm.
• Can I use the SBR30A100CT in a high-temperature environment?
  The SBR30A100CT is rated for operation up to 150°C, but it's recommended to derate the current handling capability at high temperatures. Consult the datasheet for specific derating information.
• How do I ensure the SBR30A100CT is properly soldered to the PCB?
  Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Ensure the component is properly aligned and the solder joints are clean and free of oxidation.
• What is the recommended storage condition for the SBR30A100CT?
  Store the SBR30A100CT in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
• Can I use the SBR30A100CT in a high-frequency switching application?
  The SBR30A100CT is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's parasitic inductance and capacitance when designing the circuit.