The recommended PCB footprint for SBR30300CTFP is a standard SOD-323 package with a 1.7mm x 1.3mm body size and a 0.5mm lead pitch. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
To ensure reliable operation of SBR30300CTFP in high-temperature environments, it is recommended to derate the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 25°C. Additionally, ensure good thermal conductivity between the device and the PCB, and consider using a heat sink if necessary.
The maximum allowable voltage for SBR30300CTFP is 30V, as specified in the datasheet. Exceeding this voltage may result in device damage or failure.
To ensure ESD protection for SBR30300CTFP, handle the device by the body or the leads, avoid touching the pins, and use an anti-static wrist strap or mat when handling the device. Additionally, consider using ESD protection devices such as TVS diodes or ESD arrays in the circuit design.
The recommended storage condition for SBR30300CTFP is in a dry, cool place with a temperature range of -40°C to 125°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
SBR30300CTFP datasheet
by Diodes Incorporated
