The recommended PCB footprint for the SBR2A40P1Q-7 is a standard SOD-123 package footprint with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal management system, and ensure that the device is properly soldered to the PCB.
Yes, the SBR2A40P1Q-7 can be used in high-frequency applications up to 1 GHz. However, it is recommended to follow the recommended operating conditions and to use a suitable PCB layout to minimize parasitic inductance and capacitance.
The maximum allowable power dissipation for the SBR2A40P1Q-7 is 1.5W at an ambient temperature of 25°C. However, this value may vary depending on the specific application and operating conditions.
Yes, the SBR2A40P1Q-7 is compatible with lead-free soldering processes. However, it is recommended to follow the recommended soldering profile and to use a suitable soldering iron and solder paste.
SBR2A40P1Q-7 datasheet
by Diodes Incorporated
