The recommended PCB footprint for the SBR2A40P1-7 is a standard SOD-123 package footprint with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal management system, and ensure good thermal conductivity between the device and the PCB.
Yes, the SBR2A40P1-7 can be used in switching regulator applications due to its low forward voltage drop and high current handling capability. However, it is essential to ensure that the device is operated within its recommended operating conditions and that the switching frequency is within the device's specified range.
The maximum allowable power dissipation for the SBR2A40P1-7 is 1.5W at a junction temperature of 150°C. It is essential to ensure that the device is operated within this power dissipation limit to prevent overheating and ensure reliability.
Yes, the SBR2A40P1-7 can be used in a parallel configuration to increase the current handling capability. However, it is essential to ensure that the devices are matched in terms of their electrical characteristics and that the current sharing is balanced to prevent overheating and ensure reliability.
SBR2A40P1-7 datasheet
by Diodes Incorporated
