SBR20U60CTFP-G datasheet by Diodes Incorporated

SBR20U60CTFP-G Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR20U60CTFP-G?
  The recommended PCB footprint for the SBR20U60CTFP-G is a standard SOD-123 package with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm, with a 0.5mm spacing between pads.
• How do I ensure reliable soldering of the SBR20U60CTFP-G?
  To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or applying excessive heat, as this can damage the device.
• What is the maximum allowable voltage stress on the SBR20U60CTFP-G during assembly?
  The maximum allowable voltage stress on the SBR20U60CTFP-G during assembly is 20V, and it's recommended to limit the voltage stress to 10V or less to ensure device reliability.
• Can I use the SBR20U60CTFP-G in a high-temperature environment?
  The SBR20U60CTFP-G is rated for operation up to 150°C, but it's recommended to derate the device's current handling capability by 20% for every 10°C above 125°C to ensure reliable operation.
• How do I handle ESD protection when handling the SBR20U60CTFP-G?
  Handle the SBR20U60CTFP-G with ESD-protective equipment, such as wrist straps or mats, and avoid touching the device's pins or body to prevent electrostatic discharge damage.