SBR20U100CTFP datasheet by Diodes Incorporated

SBR20U100CTFP Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR20U100CTFP?
  The recommended PCB footprint for the SBR20U100CTFP is a standard SOD-123 package with a minimum pad size of 1.3mm x 1.3mm and a maximum pad size of 1.5mm x 1.5mm, with a 0.5mm spacing between pads.
• How do I ensure reliable soldering of the SBR20U100CTFP?
  To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or applying excessive heat, as this can damage the device.
• What is the maximum allowable voltage stress on the SBR20U100CTFP?
  The maximum allowable voltage stress on the SBR20U100CTFP is 20V, as specified in the datasheet. Exceeding this voltage can cause permanent damage to the device.
• Can I use the SBR20U100CTFP in a high-temperature environment?
  The SBR20U100CTFP is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet to ensure reliable operation.
• How do I handle ESD protection when handling the SBR20U100CTFP?
  Handle the SBR20U100CTFP with ESD-protective equipment, such as an ESD wrist strap or mat, to prevent electrostatic discharge damage. Avoid touching the device's pins or body to prevent ESD damage.