The recommended PCB footprint for SBR20100CTFP is a standard SOD-123 package footprint with a pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliability in high-temperature applications, it is recommended to follow the derating curve provided in the datasheet, and to ensure that the device is operated within the recommended operating temperature range of -55°C to 150°C.
The maximum allowable current for SBR20100CTFP is 10A, but it is recommended to operate the device at a maximum current of 5A to ensure reliability and to prevent overheating.
Yes, SBR20100CTFP can be used in high-frequency applications up to 1MHz, but it is recommended to follow the recommended layout and PCB design guidelines to minimize parasitic inductance and capacitance.
To handle thermal management, it is recommended to use a thermal pad on the PCB, and to ensure good thermal conductivity between the device and the PCB. Additionally, it is recommended to use a heat sink or a thermal interface material to improve heat dissipation.