The recommended footprint and land pattern for the SBR15U100CTL-13 can be found in the Diodes Incorporated's application note AN-114, which provides guidelines for PCB layout and assembly.
To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
The maximum allowable voltage stress for the SBR15U100CTL-13 is 150% of the rated voltage, but it is recommended to follow the derating guidelines provided in the datasheet to ensure reliable operation.
Yes, the SBR15U100CTL-13 can be used in parallel to increase current handling, but it is recommended to ensure that the devices are matched in terms of electrical characteristics and that the current sharing is balanced to avoid overheating.
The recommended storage and handling procedure for the SBR15U100CTL-13 is to store the devices in their original packaging, away from direct sunlight and moisture, and to handle them with anti-static precautions to prevent damage from electrostatic discharge.
SBR15U100CTL-13 datasheet
by Diodes Incorporated
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