The recommended footprint and land pattern for the SBR10U45SP5Q-13 can be found in the Diodes Incorporated's application note AN-111, which provides guidelines for PCB layout and assembly.
To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
The maximum allowable voltage stress for the SBR10U45SP5Q-13 is 45V, as specified in the datasheet. Exceeding this voltage may result in reduced reliability or even device failure.
Yes, the SBR10U45SP5Q-13 can be used in high-frequency applications, but it is recommended to consider the device's parasitic capacitance and inductance, and to use proper PCB layout and decoupling techniques to minimize high-frequency losses.
To prevent damage, it is recommended to store the SBR10U45SP5Q-13 in its original packaging, away from direct sunlight and moisture, and to handle the devices by the body or leads, rather than the die attach area.
SBR10U45SP5Q-13 datasheet
by Diodes Incorporated
