SBR10U200CTFP datasheet by Diodes Incorporated

SBR10U200CTFP Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR10U200CTFP?
  The recommended PCB footprint for the SBR10U200CTFP is a standard SOD-123 package with a 1.6mm x 0.8mm pad size and a 0.5mm x 0.5mm thermal pad.
• Can I use the SBR10U200CTFP in a high-temperature environment?
  While the SBR10U200CTFP has a maximum operating junction temperature of 150°C, it's recommended to derate the device's power dissipation to ensure reliable operation above 125°C. Consult the datasheet for thermal impedance and power derating information.
• How do I ensure the SBR10U200CTFP is properly soldered to the PCB?
  To ensure proper soldering, follow the recommended soldering profile: peak temperature 260°C, time above 217°C 10-15 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point above 217°C.
• What is the recommended storage condition for the SBR10U200CTFP?
  Store the SBR10U200CTFP in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
• Can I use the SBR10U200CTFP in a high-frequency switching application?
  While the SBR10U200CTFP is suitable for high-frequency switching applications, its performance may degrade above 100 kHz. Consult the datasheet for switching characteristics and consider using a device with a faster switching time if necessary.