The recommended PCB footprint for SBR10200CTFP is a standard SOD-123 package footprint with a pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable operation of SBR10200CTFP in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and airflow, and ensuring that the device is operated within its specified temperature range.
The maximum allowable voltage stress for SBR10200CTFP is 100V, and it is recommended to operate the device within its specified voltage range to ensure reliable operation.
To handle ESD protection for SBR10200CTFP, it is recommended to follow proper ESD handling procedures, such as using ESD-safe materials and equipment, and ensuring that the device is properly grounded during handling and assembly.
The recommended storage condition for SBR10200CTFP is in a dry, cool place, away from direct sunlight and moisture, and in its original packaging or an ESD-safe container.
SBR10200CTFP datasheet
by Diodes Incorporated
