SBR05M100BLP-7 datasheet by Diodes Incorporated

SBR05M100BLP-7 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for SBR05M100BLP-7?
  The recommended land pattern for SBR05M100BLP-7 is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.2mm around the pad.
• Can I use SBR05M100BLP-7 in a high-temperature environment?
  While SBR05M100BLP-7 is rated for operation up to 150°C, it's recommended to derate the voltage and current ratings at higher temperatures to ensure reliable operation. Consult the datasheet and application notes for more information.
• How do I ensure the reliability of SBR05M100BLP-7 in a high-reliability application?
  To ensure the reliability of SBR05M100BLP-7, follow the recommended storage and handling procedures, use a clean and dry assembly process, and avoid exceeding the maximum ratings. Additionally, consider using a moisture-sensitive device (MSD) label and following the IPC-J-STD-020 standard for moisture sensitivity.
• Can I use SBR05M100BLP-7 in a switching power supply application?
  Yes, SBR05M100BLP-7 is suitable for use in switching power supply applications due to its low forward voltage drop and high current handling capability. However, ensure that the device is properly heatsinked and that the maximum ratings are not exceeded.
• What is the recommended soldering profile for SBR05M100BLP-7?
  The recommended soldering profile for SBR05M100BLP-7 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process is done in a nitrogen atmosphere to prevent oxidation.