SBLB10L25-E3/81 datasheet by Vishay Semiconductors

SBLB10L25-E3/81 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBLB10L25-E3/81?
  The recommended PCB footprint for the SBLB10L25-E3/81 is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a thermal pad of 2.5 mm x 2.5 mm.
• How do I ensure reliable soldering of the SBLB10L25-E3/81?
  To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
• What is the maximum allowed voltage derating for the SBLB10L25-E3/81?
  The maximum allowed voltage derating for the SBLB10L25-E3/81 is 80% of the rated voltage, which is 25 V. Therefore, the maximum allowed voltage derating is 20 V.
• How do I handle the SBLB10L25-E3/81 during storage and shipping?
  Handle the SBLB10L25-E3/81 with care to prevent mechanical stress and damage. Store the components in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads during handling.
• What is the recommended reflow soldering profile for the SBLB10L25-E3/81?
  The recommended reflow soldering profile for the SBLB10L25-E3/81 is a peak temperature of 240°C to 250°C, with a dwell time of 20-30 seconds above 220°C.