A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the bottom layer.
The SBL3045PT requires a bias voltage of 5V to 15V. A stable voltage source with minimal ripple is recommended. A decoupling capacitor of 10uF or larger should be placed close to the device to filter out noise.
The SBL3045PT can handle a maximum continuous current of 3A. However, the device can handle higher currents for short durations. It's recommended to derate the current handling capability based on the ambient temperature and PCB thermal design.
A TVS diode or a zener diode can be used to protect the device from overvoltage. For ESD protection, a diode array or a dedicated ESD protection IC can be used. It's recommended to follow the datasheet guidelines for ESD protection.
The SBL3045PT should be stored in a dry, cool place away from direct sunlight. The device should be handled with an anti-static wrist strap or mat to prevent ESD damage. It's recommended to follow the standard ESD handling procedures.
SBL3045PT datasheet
by Diodes Incorporated
