For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the package, and to connect it to a large copper area on the PCB. Additionally, using multiple vias to connect the thermal pad to an internal or bottom-side copper plane can help to dissipate heat more efficiently.
To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature, and ensure that the PCB is designed to withstand the expected operating temperatures.
The SBG1025L-T-F has built-in ESD protection, but it is still important to follow standard ESD handling precautions when handling the device. This includes using an ESD wrist strap or mat, storing the devices in anti-static packaging, and avoiding touching the pins or leads during handling.
The SBG1025L-T-F is a commercial-grade device, but it can be used in high-reliability or automotive applications with proper qualification and testing. It is essential to consult with Diodes Incorporated's application engineers and to follow the relevant industry standards and guidelines for qualification and testing.
The recommended soldering profile for the SBG1025L-T-F is a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. It is essential to follow the recommended soldering profile to ensure reliable operation and to prevent damage to the device.
SBG1025L-T-F datasheet
by Diodes Incorporated
Findchips
Findchips