The recommended PCB footprint for the SB160-E3/73 is a standard SMD (Surface Mount Device) footprint with a pad size of 2.5 mm x 1.5 mm and a pitch of 1.5 mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent thermal runaway.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the component. Make sure to follow the recommended soldering profile and avoid overheating the component.
The maximum allowed voltage derating for the SB160-E3/73 is 10% of the maximum rated voltage. For example, if the maximum rated voltage is 160 V, the maximum allowed voltage derating would be 16 V. Exceeding this derating may affect the component's reliability and lifespan.
To calculate the power dissipation of the SB160-E3/73, use the following formula: Pd = (Vr x Ir) / (RthJA x (Tj - Ta)), where Pd is the power dissipation, Vr is the reverse voltage, Ir is the reverse current, RthJA is the thermal resistance, Tj is the junction temperature, and Ta is the ambient temperature.
The recommended storage condition for the SB160-E3/73 is in a dry, cool place with a temperature range of -40°C to 30°C and a relative humidity of 60% or less. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.
SB160-E3/73 datasheet
by Vishay Semiconductors
