A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power and ground traces as short as possible, and use a 10uF capacitor between VCC and GND for decoupling.
Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device, and consider using a thermal interface material to improve heat transfer. Also, follow the recommended operating temperature range and derate the device accordingly.
A 1uF to 10uF ceramic capacitor is recommended for input decoupling. The capacitor value depends on the input voltage ripple and noise requirements. A larger capacitor value can help reduce output noise, but may increase the startup time.
Use the shutdown pin to turn off the device when not in use. In low-power modes, reduce the clock frequency, disable unnecessary peripherals, and use the power-down mode. Also, consider using a low-power oscillator or a real-time clock (RTC) to minimize power consumption.
Use a TVS (Transient Voltage Suppressor) diode or a zener diode with a 1kΩ resistor in series to protect the device from ESD. Ensure the ESD protection circuit is designed to handle the maximum expected ESD voltage and current.