ABLIC Inc. recommends a 4-layer PCB with a solid ground plane and a separate power plane for the VCC and VSS pins. Additionally, keep the input and output traces as short as possible and avoid routing them near noise sources.
The S-80818CNNB-B8DT2U has a thermal pad on the bottom, which should be connected to a thermal land on the PCB. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
ABLIC Inc. recommends a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max) for hand soldering. For reflow soldering, follow the JEDEC J-STD-020D standard. Consult the datasheet for more detailed information.
Follow the recommended PCB layout and ensure that the device is properly decoupled with capacitors. Use shielding and filtering components as necessary to reduce electromagnetic interference (EMI). Consult the datasheet and ABLIC Inc.'s application notes for more information.
Store the S-80818CNNB-B8DT2U in a dry, cool place away from direct sunlight and moisture. Handle the device by the edges to prevent damage to the pins. Avoid bending or flexing the pins, and use an anti-static wrist strap or mat when handling the device.
S-80818CNNB-B8DT2U datasheet
by ABLIC Inc.
