ABLIC Inc. recommends a PCB layout with a solid ground plane, minimal trace length, and a decoupling capacitor (e.g., 10nF) between VCC and GND to reduce noise and ensure stable operation.
The S-1313D30-M5T1U3 has a thermal resistance of 125°C/W. Ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout to minimize thermal resistance. Avoid exposing the device to high temperatures during soldering or operation.
ABLIC Inc. recommends a 10uF to 22uF ceramic capacitor (X5R or X7R type) between VCC and GND to filter out noise and ensure stable voltage supply.
Check the input voltage, ensure the EN pin is properly biased, verify the output capacitor value and type, and inspect the PCB layout for any errors or noise issues. Consult the datasheet and application notes for more detailed troubleshooting guidance.
Yes, the S-1313D30-M5T1U3 is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C.