ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a thermal via diameter of 0.3mm, and a minimum of 5 thermal vias. Additionally, a solid copper plane on the bottom layer can help to dissipate heat efficiently.
The RSB12JS2FHT2R has an integrated Schottky barrier diode. To ensure proper biasing, connect the anode to a voltage source (e.g., VCC) and the cathode to the load or ground. The recommended forward voltage is 0.3V to 0.5V.
The RSB12JS2FHT2R can withstand a surge current of up to 100A for 10ms, according to ROHM's datasheet. However, it's essential to consider the application's specific requirements and ensure the device is operated within its recommended specifications.
Yes, the RSB12JS2FHT2R is suitable for high-frequency switching applications due to its low reverse recovery time (trr) of 30ns and low capacitance (Cj) of 120pF. However, ensure the device is operated within its recommended frequency range and consider the application's specific requirements.
To handle power dissipation in high-temperature environments, ensure proper heat sinking, use a thermal interface material (TIM) with a high thermal conductivity, and consider using a heat sink with a high thermal dissipation capacity. Additionally, derate the device's power rating according to the ambient temperature.
