RRS090P03HZGTB datasheet by ROHM Semiconductor

RRS090P03HZGTB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  ROHM recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal via array under the IC can help to reduce thermal resistance.
• How do I ensure the reliability of the device in high-temperature applications?
  To ensure reliability, ROHM recommends following the recommended operating temperature range and derating the power dissipation accordingly. Additionally, using a thermally conductive material, such as a heat sink or thermal tape, can help to reduce the junction temperature.
• What is the recommended soldering profile for this device?
  ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. It's also important to follow the recommended soldering conditions and handling precautions to prevent damage to the device.
• Can I use this device in a high-humidity environment?
  The RRS090P03HZGTB is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, ROHM does offer moisture-resistant packaging options for certain products. Contact ROHM for more information.
• What is the recommended storage condition for this device?
  ROHM recommends storing the device in a dry, cool place with a temperature range of 5-30°C and humidity below 60%. The device should be stored in its original packaging or an anti-static bag to prevent damage.