The thermal resistance (Rth) of the RN55D2490FB14 is approximately 250°C/W, which means it can dissipate 1W of power per 250°C temperature rise.
Yes, the RN55D2490FB14 is suitable for high-frequency applications due to its thin-film construction, which minimizes parasitic inductance and capacitance.
The RN55D2490FB14 has a maximum operating temperature of 155°C, making it suitable for high-temperature applications. However, derating is required above 125°C to ensure reliability.
The power rating of the RN55D2490FB14 at 70°C is 0.5W. This is lower than the maximum power rating of 1W at 25°C due to thermal derating.
Yes, the RN55D2490FB14 is compatible with lead-free soldering processes, making it suitable for RoHS-compliant designs.
