A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the inner layers.
Ensure that the device is operated within the recommended temperature range (up to 125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power dissipation at high temperatures.
A reflow soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux.
Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure that the workstation is ESD-protected. Store the device in an anti-static bag or tube.
Store the device in a dry, cool place (below 25°C/77°F and 60% RH). Avoid exposure to direct sunlight, moisture, or extreme temperatures. Use anti-static packaging and avoid bending or flexing the leads.
RN2425(TE85L,F) datasheet
by Toshiba America Electronic Components
