For optimal thermal performance, it is recommended to have a solid copper plane under the device, with multiple vias to the thermal pad. The thermal pad should be connected to a large copper area on the bottom layer, and the PCB should have a minimum of 2oz copper thickness.
To ensure stability and prevent oscillations, it is recommended to use a minimum output capacitance of 10uF, with an ESR of less than 1 ohm. Additionally, the output capacitor should be placed as close as possible to the output pin, and the input capacitor should be placed as close as possible to the input pin.
The maximum input voltage that can be applied to the device is 18V, although the recommended operating input voltage range is 5.5V to 15V. Applying voltages above 18V can cause damage to the device.
The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current. The maximum power dissipation of the device is 2.5W.
The recommended input capacitor value is 1uF to 10uF, with a voltage rating of at least 25V. A ceramic or film capacitor with low ESR is recommended, such as an X5R or X7R dielectric capacitor.
REG113NA-5/250G4 datasheet
by Texas Instruments
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