REF3433MDBVTEP datasheet by Texas Instruments

REF3433MDBVTEP Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the REF3433MDBVTEP to minimize noise and ensure optimal performance?
  A good PCB layout for the REF3433MDBVTEP involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
• How do I ensure the REF3433MDBVTEP is properly decoupled to prevent oscillations and noise?
  To ensure proper decoupling, place a 10uF ceramic capacitor between the VIN pin and the GND pin, and a 100nF ceramic capacitor between the VOUT pin and the GND pin. Additionally, use a 1uF ceramic capacitor between the VIN pin and the VOUT pin.
• What is the maximum output current that the REF3433MDBVTEP can provide?
  The REF3433MDBVTEP can provide a maximum output current of 50mA. However, it's recommended to limit the output current to 30mA to ensure optimal performance and prevent overheating.
• How do I adjust the output voltage of the REF3433MDBVTEP?
  The output voltage of the REF3433MDBVTEP can be adjusted by using an external resistor divider network between the VOUT pin and the ADJ pin. The output voltage can be calculated using the formula: VOUT = 1.24V x (R1 + R2) / R2.
• What is the thermal shutdown temperature of the REF3433MDBVTEP?
  The thermal shutdown temperature of the REF3433MDBVTEP is 150°C. The device will shut down when the junction temperature exceeds this value, and will restart when the temperature drops below 130°C.