Texas Instruments provides a recommended PCB layout in the REF3312 datasheet, which includes guidelines for component placement, routing, and thermal management. It's essential to follow these guidelines to minimize noise, ensure stability, and achieve the specified accuracy.
The REF3312AIDCKRG4 has a relatively high output voltage noise of 10 μVrms. To minimize the impact of this noise, use a low-pass filter, such as a 1 kΩ resistor and a 10 nF capacitor, at the output of the device. Additionally, consider using a noise-reducing capacitor, like a 10 μF ceramic capacitor, between the output and ground.
The REF3312AIDCKRG4 can drive a maximum capacitive load of 10 nF. Exceeding this limit may cause the device to oscillate or become unstable. If a larger capacitive load is required, consider adding a buffer amplifier or an op-amp with a high capacitive drive capability.
To ensure proper operation, power the REF3312AIDCKRG4 with a clean, low-noise supply voltage. Use a 0.1 μF decoupling capacitor between the VCC pin and ground, and a 10 μF bulk capacitor between the power supply and ground. Place these capacitors as close to the device as possible to minimize inductive noise.
The thermal resistance of the REF3312AIDCKRG4 package (QFN-16) is 34.4°C/W (junction-to-ambient) and 10.4°C/W (junction-to-case). This information is essential for thermal management and ensuring the device operates within its specified temperature range.
REF3312AIDCKRG4 datasheet
by Texas Instruments
