REF3233AIDBVTG4 datasheet by Texas Instruments

REF3233AIDBVTG4 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of the REF3233AIDBVTG4?
  Texas Instruments recommends a star-ground layout with a solid ground plane, and placing the REF3233AIDBVTG4 close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) it is supplying. Additionally, keep the input and output traces short and separate to minimize noise and coupling.
• How do I ensure the REF3233AIDBVTG4 is stable and accurate over temperature?
  To ensure stability and accuracy over temperature, it is recommended to use a low-ESR capacitor (e.g., 10uF ceramic) at the output pin, and to keep the device away from heat sources. Additionally, consider using a thermally conductive material (e.g., thermal tape) to attach the device to a heat sink or PCB ground plane.
• What is the maximum capacitive load that the REF3233AIDBVTG4 can drive?
  The REF3233AIDBVTG4 can drive up to 10uF of capacitive load. However, it is recommended to limit the capacitive load to 4.7uF or less to ensure stability and prevent oscillations.
• Can I use the REF3233AIDBVTG4 as a voltage reference for an ADC or DAC with a different voltage range?
  Yes, the REF3233AIDBVTG4 can be used as a voltage reference for an ADC or DAC with a different voltage range, but it may require additional circuitry to scale the output voltage. For example, a resistive divider network can be used to scale the 3.3V output to a lower voltage range.
• How do I handle the power-up and power-down sequencing of the REF3233AIDBVTG4?
  It is recommended to power up the REF3233AIDBVTG4 after the input voltage has reached its nominal value, and to power down the device before the input voltage drops below its minimum specified value. This ensures that the device is not subjected to excessive voltage stress or oscillations during power-up and power-down.