REF1112AIDBZR datasheet by Texas Instruments

REF1112AIDBZR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  For optimal performance, it is recommended to follow a star-grounding layout, where the REF1112AIDBZR is placed close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC), and the power supply lines are separated from the signal lines. Additionally, use a solid ground plane and avoid routing digital signals near the REF1112AIDBZR.
• How do I ensure accurate voltage reference output?
  To ensure accurate voltage reference output, make sure to decouple the REF1112AIDBZR with a 10uF capacitor between the VOUT pin and GND, and a 0.1uF capacitor between the VIN pin and GND. Also, ensure that the input voltage is within the recommended operating range of 4.5V to 18V.
• What is the thermal impedance of the REF1112AIDBZR package?
  The thermal impedance of the REF1112AIDBZR package is typically around 30°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 30°C above the ambient temperature.
• Can I use the REF1112AIDBZR in a high-temperature environment?
  The REF1112AIDBZR is rated for operation up to 125°C. However, the accuracy and stability of the voltage reference output may degrade at high temperatures. It is recommended to derate the output voltage and ensure proper thermal management to maintain accuracy and reliability.
• How do I minimize noise and electromagnetic interference (EMI) in my design?
  To minimize noise and EMI, use a shielded enclosure, keep the REF1112AIDBZR away from noise sources, and use a low-pass filter or ferrite bead on the input and output lines. Additionally, ensure that the PCB layout is designed to minimize radiation and coupling between signals.