RDC4072S05 datasheet by XP Power

RDC4072S05 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
• Can I use the RDC4072S05 in a high-vibration environment?
  Yes, the RDC4072S05 is designed to withstand high-vibration environments. However, it's essential to ensure that the module is properly secured to the PCB and that the PCB is designed to withstand the vibration levels. XP Power recommends following the IPC-9592 standard for vibration testing.
• How do I ensure electromagnetic compatibility (EMC) with the RDC4072S05?
  To ensure EMC, XP Power recommends following the CISPR 22 and EN 55022 standards for conducted emissions. Additionally, the module should be placed at least 1 cm away from other components, and a metal shield or screen should be used to enclose the module.
• What is the maximum allowable capacitance for the output filter?
  The maximum allowable capacitance for the output filter is 10 μF. Exceeding this value may affect the module's stability and performance.
• Can I use the RDC4072S05 in a humid environment?
  Yes, the RDC4072S05 is designed to operate in humid environments. However, it's essential to ensure that the module is properly sealed and that the PCB is designed to withstand humidity levels. XP Power recommends following the IEC 60068-2-30 standard for humidity testing.