RDC40110S12 datasheet by XP Power

RDC40110S12 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• How do I ensure reliable start-up of the module in my application?
  To ensure reliable start-up, XP Power recommends applying a slow ramp-up of the input voltage (typically 10-20 ms) to prevent inrush currents and ensure the module's internal components are properly initialized. Additionally, a soft-start circuit can be implemented to limit the inrush current.
• What is the maximum capacitance I can use on the output of the module?
  The maximum capacitance on the output of the RDC40110S12 is 47 μF. Exceeding this value may cause instability or oscillation in the module's output. It's essential to follow the recommended output capacitance value to ensure stable operation.
• Can I use the RDC40110S12 in a high-vibration environment?
  Yes, the RDC40110S12 is designed to operate in high-vibration environments. However, it's essential to ensure the module is properly secured to the PCB and the PCB is securely fastened to the system's chassis to prevent mechanical stress and damage.
• What is the recommended input fuse rating for the module?
  XP Power recommends using a fuse with a rating of 2-3 A, slow-blow type, to protect the module from input overcurrent conditions. The fuse should be placed as close to the input terminals as possible to minimize the risk of damage from input overvoltage or overcurrent.