The recommended land pattern for RC3216J106CS is a rectangular pad with a size of 3.2mm x 1.6mm, with a solder mask clearance of 0.2mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
The RC3216J106CS is a moisture-sensitive device. To handle it, follow the standard moisture-sensitive device handling procedures, such as storing the components in a dry environment, using a dry pack or nitrogen-filled packaging, and baking the components before reflow soldering if they have been exposed to moisture.
The maximum reflow temperature for RC3216J106CS is 260°C, with a peak temperature of 250°C. The reflow profile should follow the standard IPC/JEDEC J-STD-020D.1 guidelines.
The RC3216J106CS is a surface-mount device and can be used in high-vibration environments. However, it's essential to ensure that the component is properly soldered and the PCB is designed to withstand the vibration. Additional mechanical support or potting may be necessary in extreme vibration environments.
The ESR of RC3216J106CS is not explicitly stated in the datasheet. However, you can estimate the ESR by using the impedance vs. frequency graph provided in the datasheet. Alternatively, you can contact Samsung Electro-Mechanics or an authorized distributor for more information on the ESR of this specific component.
