RC1608F101CS datasheet by Samsung Electro-Mechanics

RC1608F101CS Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the RC1608F101CS?
  The recommended land pattern for the RC1608F101CS is a rectangular pad with a size of 1.6mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
• How do I handle the thermal considerations for the RC1608F101CS?
  The RC1608F101CS has a thermal resistance of 350°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
• What is the maximum power rating for the RC1608F101CS?
  The maximum power rating for the RC1608F101CS is 0.125W. Ensure that the component is not subjected to power exceeding this rating to prevent damage or failure.
• How do I store the RC1608F101CS to prevent moisture absorption?
  Store the RC1608F101CS in a dry, cool place, away from direct sunlight and moisture. Use airtight packaging or a dry box to prevent moisture absorption.
• What is the recommended soldering temperature for the RC1608F101CS?
  The recommended soldering temperature for the RC1608F101CS is between 230°C to 250°C, with a maximum soldering time of 3 seconds.