A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
Use a high-quality output capacitor with low ESR, ensure a stable input voltage, and minimize noise on the VIN pin to ensure stable output voltage regulation.
The maximum allowable ripple voltage on the input capacitor is 10% of the input voltage to ensure stable operation.
Yes, a ceramic capacitor can be used for the output capacitor, but ensure it has a high enough capacitance value and a low enough ESR to maintain stability.
Calculate the power dissipation using the formula: Pd = (VIN - VOUT) x IOUT, where Pd is the power dissipation, VIN is the input voltage, VOUT is the output voltage, and IOUT is the output current.