RB085T-40NZC9 datasheet by ROHM Semiconductor

RB085T-40NZC9 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 1oz copper thickness and a thermal via diameter of 0.3mm to ensure optimal heat dissipation.
• How do I ensure the reliability of the device in high-temperature applications?
  To ensure reliability, follow the recommended operating temperature range (Ta = -40°C to 150°C), use a suitable thermal management system, and avoid exceeding the maximum junction temperature (Tj = 175°C).
• What is the recommended soldering profile for this device?
  ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s to prevent thermal shock and ensure reliable solder joints.
• Can I use this device in a high-humidity environment?
  Yes, the RB085T-40NZC9 is designed to operate in humid environments, but it's essential to follow proper moisture sensitivity level (MSL) handling and storage procedures to prevent damage.
• How do I troubleshoot issues related to the device's internal voltage regulator?
  To troubleshoot internal voltage regulator issues, check the input voltage, output voltage, and current consumption. Ensure that the input voltage is within the recommended range (Vin = 4.5V to 40V), and the output voltage is within the specified range (Vout = 5V ± 5%).