Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to have a minimum of 2 oz copper thickness and to use thermal vias to connect the thermal pad to the ground plane.
To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet.
Texas Instruments recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure optimal performance.
To troubleshoot issues with the OCP feature, check the output current limit setting, ensure that the sense resistor is properly connected and sized, and verify that the OCP threshold is set correctly. Additionally, check for any noise or oscillations on the output that may be triggering the OCP feature.
Texas Instruments recommends using a low-ESR ceramic capacitor with a value of 10uF to 47uF for the output capacitor. The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ensure optimal performance.
