The recommended PCB footprint for PSMN1R2-25YLC,115 is a D²PAK (TO-263) package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 3.5mm x 3.5mm.
To ensure reliability in high-temperature applications, ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C, and follow proper thermal design and heat sinking guidelines.
The maximum allowed voltage on the gate of the PSMN1R2-25YLC,115 is ±20V, with a recommended maximum voltage of 15V for reliable operation.
To protect the PSMN1R2-25YLC,115 from ESD, handle the device with anti-static wrist straps, mats, or bags, and ensure the PCB design includes ESD protection components such as TVS diodes or ESD arrays.
The recommended gate resistor value for the PSMN1R2-25YLC,115 is between 1kΩ to 10kΩ, depending on the specific application and switching frequency requirements.
PSMN1R2-25YLC,115 datasheet
by NXP Semiconductors
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