The maximum operating temperature range for PSMN0R9-25YLC,115 is -40°C to 150°C.
To ensure reliability, follow the recommended derating guidelines, use a suitable thermal interface material, and ensure good thermal design and heat sinking.
Follow the recommended PCB layout and thermal design guidelines in the NXP application note AN11160, and ensure a minimum of 2 oz copper thickness for optimal thermal performance.
Yes, PSMN0R9-25YLC,115 is AEC-Q101 qualified, making it suitable for automotive applications. However, ensure compliance with specific automotive industry standards and regulations.
Handle the device by the body, avoid touching the leads, and store it in a dry, ESD-protected environment to prevent damage.