The recommended land pattern for PNM1206E1002BST5 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While PNM1206E1002BST5 has a high operating temperature range of -55°C to 150°C, it's essential to consider the derating of the component's power rating at high temperatures. Consult the datasheet and application notes for specific guidance on high-temperature usage.
PNM1206E1002BST5 is an ESD-sensitive device. To prevent damage, handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the assembly process and storage environment are ESD-controlled.
The recommended soldering profile for PNM1206E1002BST5 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of thermal damage.
While PNM1206E1002BST5 is a general-purpose resistor, it's not optimized for high-frequency applications. For frequencies above 100 MHz, consider using a high-frequency resistor with a lower parasitic inductance and capacitance.
