PESD1FLEX,215 datasheet by NXP Semiconductors

PESD1FLEX,215 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of PESD1FLEX,215?
  A good PCB layout for PESD1FLEX,215 involves keeping the signal paths short, using a solid ground plane, and placing the device close to the protected IC. Additionally, the PCB should be designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI).
• How does the PESD1FLEX,215 handle surge pulses and electrostatic discharges?
  The PESD1FLEX,215 is designed to handle surge pulses and electrostatic discharges (ESD) according to the IEC 61000-4-2 and IEC 61000-4-5 standards. It can withstand up to 30 kV of ESD and 3.3 kV of surge pulses.
• What is the maximum operating temperature range for the PESD1FLEX,215?
  The PESD1FLEX,215 can operate over a temperature range of -40°C to 125°C, making it suitable for use in a wide range of applications.
• Can the PESD1FLEX,215 be used in high-speed data lines?
  Yes, the PESD1FLEX,215 is suitable for use in high-speed data lines due to its low capacitance and high bandwidth. It is commonly used in applications such as USB, HDMI, and Ethernet.
• Is the PESD1FLEX,215 compatible with automotive applications?
  Yes, the PESD1FLEX,215 is AEC-Q101 qualified, making it suitable for use in automotive applications. It meets the stringent requirements for electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection in automotive systems.