A good PCB layout for the PCF2112CT involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI. A 4-layer PCB with a dedicated power plane is recommended.
To ensure proper power and decoupling, use a high-quality decoupling capacitor (e.g., 100nF) close to the VDD pin, and a 10uF capacitor for bulk decoupling. Also, ensure a stable voltage supply and follow the recommended voltage range (1.8V to 5.5V).
The PCF2112CT supports clock frequencies up to 32 kHz, but the maximum frequency may vary depending on the specific application and oscillator configuration. Consult the datasheet and application notes for more information.
To configure the PCF2112CT for low-power mode, set the device to standby mode by writing to the control register. This reduces the current consumption to a few microamperes. Additionally, consider using a low-power oscillator and optimizing the clock frequency for further power savings.
The PCF2112CT has a maximum junction temperature of 150°C. Ensure good thermal design practices, such as using a heat sink or thermal pad, to keep the device within the recommended operating temperature range (–40°C to 85°C).
PCF2112CT/1,118 datasheet
by NXP Semiconductors
