A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and avoid exceeding 3 reflows. Use a soldering iron with a temperature-controlled tip to prevent overheating.
The maximum allowed voltage on the EN pin is VCC + 0.3V. Exceeding this voltage may damage the device.
The device is rated for operation up to 125°C. However, the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal design and heat dissipation to prevent overheating.
Follow proper handling and storage procedures to prevent EOS damage. Use an anti-static wrist strap or mat, and avoid touching the device pins or handling the device in humid environments.
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