A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and EMI.
Use a thermally conductive material for the heat sink, ensure good airflow, and consider using a thermal interface material (TIM) to improve heat transfer. Also, follow the recommended operating conditions and derating guidelines.
Use a pi-filter (L-C-L) or a T-filter (L-C-R-L) at the input to reduce EMI and noise. For the output, use a simple RC filter or a more complex filter like a 3rd-order elliptical filter to reduce ripple and noise.
Use a low-ESR output capacitor to minimize voltage ripple and ensure stable operation. Also, consider using a current sense resistor and a current limit circuit to prevent overcurrent conditions.
The high switching frequency can generate EMI and noise. Use shielding, filtering, and grounding techniques to minimize EMI. Also, consider using a spread-spectrum clocking technique to reduce EMI.