P6SMB200A-E3/5B datasheet by Vishay Semiconductors

P6SMB200A-E3/5B Frequently Asked Questions (FAQs)

• What is the recommended footprint and land pattern for P6SMB200A-E3/5B?
  The recommended footprint and land pattern for P6SMB200A-E3/5B can be found in the Vishay Intertechnologies' application note AN10343, which provides guidelines for surface mount assembly of SMB packages.
• How do I handle the thermal management of P6SMB200A-E3/5B?
  To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) between the device and the heat sink. The thermal resistance of the device is specified in the datasheet.
• What is the maximum allowable voltage stress on the P6SMB200A-E3/5B?
  The maximum allowable voltage stress on the P6SMB200A-E3/5B is 10% above the rated working voltage, but not exceeding the absolute maximum rating of 250V.
• Can I use P6SMB200A-E3/5B in a high-frequency circuit?
  While P6SMB200A-E3/5B is primarily designed for low-frequency applications, it can be used in high-frequency circuits up to 100 kHz. However, the device's performance may degrade at higher frequencies due to internal capacitance and inductance.
• How do I ensure the reliability of P6SMB200A-E3/5B in a high-temperature environment?
  To ensure reliability in high-temperature environments, it is recommended to derate the device's voltage and current ratings according to the datasheet, and to provide adequate heat sinking and thermal management.