NXP provides a recommended PCB layout in the application note AN11586, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
NXP recommends following the guidelines in the application note AN11587 for EMC design considerations, including PCB layout, component selection, and shielding to minimize electromagnetic interference and ensure compliance with regulatory standards.
For high-power applications, it's essential to consider thermal design factors such as junction-to-case thermal resistance, thermal interface material, and heat sink design. NXP provides guidance on thermal design in the application note AN11586 and the P5DF081X0/T1AR1070 thermal modeling report.
The selection of input capacitors depends on factors such as input voltage, current, and frequency. NXP recommends using X7R or X5R ceramic capacitors with a voltage rating of at least 1.5 times the maximum input voltage. The application note AN11588 provides more detailed guidance on input capacitor selection.
NXP provides soldering and assembly guidelines in the application note AN11589, which includes information on soldering temperatures, times, and techniques, as well as component handling and storage recommendations.
