Stancor recommends a multi-layer PCB with a dedicated ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the power traces. Additionally, a heat sink with a thermal interface material (TIM) should be used to keep the junction temperature below 125°C.
To ensure reliable start-up and shutdown, Stancor recommends a soft-start circuit to limit inrush current and a shutdown circuit to prevent voltage spikes. Additionally, a minimum of 10 ms delay should be implemented between power-on and enable signals.
Stancor recommends using a pi-filter (L-C-L) configuration on the input and output lines to reduce EMI emissions. The filter components should be selected based on the specific application and frequency range of operation.
Stancor recommends using overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device. The OVP threshold should be set to 1.5 times the maximum input voltage, and the UVP threshold should be set to 0.7 times the minimum input voltage.
Stancor recommends using a voltage sense resistor and an ADC or a dedicated voltage monitoring IC to monitor the output voltage. The output voltage can be controlled using a feedback loop with a voltage reference and an error amplifier.
